Illustrate:
Product name: High-quality surface, low self-fluorescence and ultra-thin borosilicate glass (MEMpax®)

MEMpax® is a borosilicate glass produced by the down-draw method and can be produced in an extremely thin thickness range, between 70µm and 125µm.

The special composition of this fire-polished substrate glass makes it suitable for various applications such as:

• MEMS (Micro Electro Mechanical Systems)
• Optical and Electrical Sensors
• Slides and Microarrays
• Wafer Level Packaging
• Wafer-Level Micro-Optics
• Suitable for anodic bonding to silicon wafers

This glass meets the latest environmental requirements of our customers. MEMpax® is also available as glass wafers. for this
We offer individual wafer specifications.
At the same time, MEMpax® has a lower thickness and, thanks to its excellent surface quality, provides thin wafers that no longer require grinding and polishing. MEMpax® can be used wherever extremely thin borosilicate glass is required.

Advantage :

• Micro Electro Mechanical Systems (MEMS):

The coefficient of linear thermal expansion is comparable to that of silicon
Suitable for anodic Bonding.
Thin borosilicate glass wafers without polishing
High heat and chemical resistance

• Biotechnology:

Transmission high
Available in various thicknesses
Excellent surface quality
Low autofluorescence

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